




Healthcare Industry News: DePuy
News Release - August 10, 2006
Broad U.S. Method Patent Issued to Archus Orthopedics, Inc.
REDMOND, Wash., Aug. 10 (HSMN NewsFeed) -- Archus Orthopedics, Inc. today announced that it has been awarded its seventh United States Patent. Arising from a 1999 patent application filed by the company's founder, Mark Reiley, M.D., U.S. Patent 7,087,084 discloses the surgical method of removing some or all of a natural facet joint and replacing it with a prosthesis anchored in the pedicle.Archus is currently conducting a U.S. clinical trial of its Total Facet Arthroplasty System(TM) "TFAS®", a novel spinal implant designed to treat spinal stenosis, a condition in which degenerative changes in the facet joints result in compression of spinal nerves producing neurological symptoms in the legs. Traditionally, patients with spinal stenosis undergo decompressive laminectomy surgery, which is often accompanied by spinal fusion. The TFAS® replaces the degenerative facet joints with a prosthetic joint implant intended to restore stability and normal motion to the spine, eliminating the need for fusion.
In addition to TFAS®, Archus is developing a suite of products to address other important and attractive applications for facet joint replacement. "Given its fundamental breadth, we believe that this patent will be applicable across our growing product line," said Fitzsimmons.
About Archus Orthopedics
Founded in July 2001, Archus Orthopedics is a privately held company developing a family of reconstructive implants to treat a variety of spine disorders resulting from degenerative changes in the facet joints. Archus has received venture capital funding from MPM Capital, InterWest Partners and Polaris Venture Partners. In January 2006, the company announced completion of a $35 Million financing led by Johnson & Johnson Development Corporation in cooperation with DePuy Spine.
Source: Archus Orthopedics
Issuer of this News Release is solely responsible for its
content.
Please address inquiries directly to the issuing company.